Electret behavior discovered in solder, specifically tin–silver

@article{Yang2021ElectretBD,
  title={Electret behavior discovered in solder, specifically tin–silver},
  author={Wenyi Yang and D. D. L. Chung},
  journal={Journal of Materials Science: Materials in Electronics},
  year={2021},
  volume={32},
  pages={19145 - 19156}
}
  • Wenyi YangD. Chung
  • Published 25 June 2021
  • Physics
  • Journal of Materials Science: Materials in Electronics
An electret is a permanent electric dipole exhibited by a material. This work provides the first report of the electret behavior of a solder, which is Sn–4Ag in the form of a fluxless unpoled wire of diameter 2.79 mm. The electret voltage increases linearly with the inter-electrode distance l, due to Ohm’s Law. The electret’s electric field also increases with l, increasing by 2.8% upon increasing l from 100 to 1000 mm. The electret discharges upon short-circuiting (with the electric field… 
2 Citations

Dielectric Behavior of an Electrically Conductive Metal-Particle Thick Film

Electrically conductive metal-particle thick films made from paints upon volatile component evaporation are widely used for electrical contacts and interconnections. Prior work on the electrical

References

SHOWING 1-10 OF 41 REFERENCES

First report of the ferroelectric behavior of a metal, as shown for solder

Ferroelectric behavior is well known for nonconductive dielectrics. This work provides the first report of this behavior in a metal, specifically a solder (Sn–4Ag), which is highly conductive. As

Electric polarization and depolarization of solder, and their effects on electrical conduction

This work provides the first report of the effect of the dielectric behavior on the conduction behavior of solder. The lead-free solder studied contains 96 wt% tin and 4 wt% silver. The electric

Effect of temperature on the electrical conduction and dielectric behavior of solder

  • Wenyi YangD. Chung
  • Materials Science, Physics
    Journal of Materials Science: Materials in Electronics
  • 2021
Solder is widely used as an electrical conductor in electronics. This paper reports the effect of heating up to 70 °C on the conduction and dielectric behavior of solder (Sn–4Ag lead-free eutectic

Electret, piezoelectret and piezoresistivity discovered in steels, with application to structural self-sensing and structural self-powering

Electret, piezoelectret, piezoresistivity and stress-dependent electric permittivity are reported in unmodified steels. Structural stress/strain self-sensing based on piezoelectret/piezoresistivity

Effect of the cooling rate in solidification on the electrical behavior of solder

  • Wenyi YangD. Chung
  • Materials Science
    Journal of Materials Science: Materials in Electronics
  • 2021
Solder is widely used for electrical interconnections in electronics, and its use involves the melting and subsequent solidification of the solder. This paper reports for the first time the effect of

Piezoelectricity, piezoresistivity and dielectricity discovered in solder

  • Xiang XiD. Chung
  • Materials Science
    Journal of Materials Science: Materials in Electronics
  • 2019
The performance and reliability of soldered joints are important for electronic packaging. This work provides the first observation of piezoelectricity (generating electric field and capacitance),

Pronounced electromigration of Cu in molten Sn-based solders

The high local temperature in flip-chip solder joints of microprocessors has raised concerns that the solder, a low melting temperature alloy, might locally liquefy and consequently cause failure of