Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis

@inproceedings{Bhagavat1999ElastoHydrodynamicII,
  title={Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis},
  author={Milind S. Bhagavat and Vishwanath Prasad and I. Kao},
  year={1999}
}
Free abrasive machining (FAM) process associated with the wiresaw wafer slicing involves a three body abrasion environment. During the process, the cutting action is caused by fine abrasives freely dispersed in the slurry, which get trapped between an axially moving taut wire and the ingot being sliced. In this paper a model is proposed wherein the entry of abrasives into the cutting zone is governed by elasto-hydrodynamic (EHD) interaction between the slurry and the wire. An EHD film is formed… CONTINUE READING

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