Efficient link-level error resilience in 3D NoCs

Abstract

Due to their scalability and flexibility, Networks-on-Chip are among the most popular communication fabrics for 3D integrated systems. 3D NoCs consist of a mix of inter-die and intra-die links implemented in different technologies. Thus, in order to guarantee correct data transmission through the 3D NoC, link reliability must be ensured. Error resilience… (More)
DOI: 10.1109/DDECS.2012.6219038

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