Effects of underfill materials on the reliability of low-K flip-chip packaging

@article{Chen2006EffectsOU,
  title={Effects of underfill materials on the reliability of low-K flip-chip packaging},
  author={K. M. Chen and D. S. Jiang and N. H. Kao and J. Y. Lai},
  journal={Microelectronics Reliability},
  year={2006},
  volume={46},
  pages={155-163}
}
The reliability of low-K flip-chip packaging has become a critical issue owing to the low strength and poor adhesion qualities of the low-K dielectric material when compared with that of SiO2 or fluorinated silicate glass (FSG). The underfill must protect the solder bumps and the low-K chip from cracking and delamination. However, the material properties of underfill are contrary to those required for preventing solder bumps and low-K chip from cracking and delamination. This study describes… CONTINUE READING
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