Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate.
This paper deals with the effects of ultrasonic irradiation on electroless copper coating i.e. metallic deposition on non-conductive substrates and on electroplating on metallic substrates. Ultrasonic irradiation was both applied during activation (surface preparation for the electroless coating) and during plating steps in both cases. Several parameters were monitored, such as plating rates, practical adhesion, hardness, internal stress versus varying acoustic powers and frequencies. Optimum conditions for irradiation time, frequency and power were determined for each step. It appears clearly that ultrasound use affects deposit properties. Then, changes in the coating mechanisms can be discussed, and several parameters will be explored in this paper, to explain enhancement of deposit properties: increase in catalyst specific area, stirring dependence, surface energy evolution, dihydrogen desorption, structure of coating.