Effects of kinematic variables on nonuniformity in chemical mechanical planarization

@inproceedings{HochengaEffectsOK,
  title={Effects of kinematic variables on nonuniformity in chemical mechanical planarization},
  author={H. Hochenga and H. Y. Tsai and M. S. Tsaib}
}
The effects of kinematic variables on the nonuniformity of the wafer in chemical mechanical planarization (CMP) are investigated. The nonuniform amount of material removal is calculated by the velocity integral and the experimental nonuniformity is measured. This analysis becomes more important as the wafer size increases and the requirement for within-wafer nonuniformity is more rigorous. The effects of the rotational and translational speeds and carrier eccentricity are discussed. The… CONTINUE READING

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