Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints

@article{Hutter2009EffectsOA,
  title={Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints},
  author={Matthias Hutter and Ralf Schmidt and Patrick Zerrer and Steffen Rauschenbach and Klaus Wittke and Wolfgang Scheel and Herbert Reichl},
  journal={2009 59th Electronic Components and Technology Conference},
  year={2009},
  pages={54-60}
}
The electronics industry has successfully transitioned to lead free soldering for computer and consumer products while in the automotive industry due to the very high reliability requirements this step is still in an ongoing process. In order to ensure or even to enhance the reliability of electronics the improvement of lead free solder joints based on Sn-Ag-Cu (SAC) solder has been the focus of many research projects already. One approach to improve the thermal fatigue properties of these… CONTINUE READING
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