Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies

@article{Tan2008EffectsOW,
  title={Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies},
  author={Wei Tan and I. Charles Ume and Ying Hung and C. F. Jeff Wu},
  journal={2008 58th Electronic Components and Technology Conference},
  year={2008},
  pages={131-138}
}
Out-of-plane displacement (warpage) has been a major thermomechanical reliability concern for board-level electronic packages. Printed wiring board (PWB) and component warpage results principally from coefficient of thermal expansion mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly reflow processes and normal operations may lead to severe solder bump reliability problems. In this research, the effect of initial PWB warpage on the… CONTINUE READING