Effects of Ramp-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

@article{Lau2005EffectsOR,
  title={Effects of Ramp-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints},
  author={Jeanie Lau and Walter Dauksher},
  journal={Proceedings Electronic Components and Technology, 2005. ECTC '05.},
  year={2005},
  pages={1292-1298}
}
The effects of temperature-cycling ramp-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package’s (SnAgCu) leadfree solder joints on a FR-4 printed circuit board (PCB) subjected to various ramp times (0.5, 1, 5, 10, and 15 minutes) for two different ranges of cycling temperatures, namely, from 0C to 100C and from… CONTINUE READING

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