Effects of Pd distribution at free air ball in Pd coated Cu wire

@article{Jung2017EffectsOP,
  title={Effects of Pd distribution at free air ball in Pd coated Cu wire},
  author={Byung Hoon Jung and Byung Kwan Yu and Seung Hyoun Kim and Jeong Tak Moon and S. J. Hong},
  journal={2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)},
  year={2017},
  pages={1-5}
}
Bonding wire, one of the bonding materials, has been rapidly changed from Au to Cu due to an increase in gold price. Although Pd coated Cu (Au-Pd-Cu) wires, which comprise the largest market share among Cu bonding wires, show high reliability compared to bare Cu wire in high-humidity reliability, the reliability issue still appears in certain area. In the… CONTINUE READING