Effects of Organic Package Warpage on Microprocessor Thermal Performance

@article{Too2007EffectsOO,
  title={Effects of Organic Package Warpage on Microprocessor Thermal Performance},
  author={Shirren Too and Jasmina Bajraktarevic Hayward and Robert B Mc Master and Tek-Seng Tan and K H Keok},
  journal={2007 Proceedings 57th Electronic Components and Technology Conference},
  year={2007},
  pages={748-754}
}
Efficient heat dissipation is a major challenge for the packaging of high power microprocessors. This paper discusses a novel lid assembly process and characterization techniques that were successfully developed for a high power microprocessor in high volume production. For a high power microprocessor flip chip organic package with under fill, die warpage as a result of CTE mismatch between the silicon and organic substrate is a challenge. A laser-based surface profiling technique was used to… CONTINUE READING