Effects of Gelatin on Electroplated Copper Through the Use of a Modified-Hydrodynamic Electroplating Test Cell
@article{Zeng2021EffectsOG,
title={Effects of Gelatin on Electroplated Copper Through the Use of a Modified-Hydrodynamic Electroplating Test Cell},
author={Tsung-Wei Zeng},
journal={International Journal of Electrochemical Science},
year={2021},
pages={210214}
}We demonstrated the effects of gelatin in an electroplating bath on the morphology of electrodeposited copper through the use of a modified-hydrodynamic electroplating test cell (M-HETC). The proposed M-HETC is an electroplating test cell that provides a stable and reproducible flow field and controllable mass transfer. In addition, the M-HETC allows exploration of the variations in the surface appearance of electrodeposits over a wide range of current densities in a single electroplating test…
