Effects of Gelatin on Electroplated Copper Through the Use of a Modified-Hydrodynamic Electroplating Test Cell

@article{Zeng2021EffectsOG,
  title={Effects of Gelatin on Electroplated Copper Through the Use of a Modified-Hydrodynamic Electroplating Test Cell},
  author={Tsung-Wei Zeng},
  journal={International Journal of Electrochemical Science},
  year={2021},
  pages={210214}
}
  • Tsung-Wei Zeng
  • Published 1 February 2021
  • Engineering
  • International Journal of Electrochemical Science
We demonstrated the effects of gelatin in an electroplating bath on the morphology of electrodeposited copper through the use of a modified-hydrodynamic electroplating test cell (M-HETC). The proposed M-HETC is an electroplating test cell that provides a stable and reproducible flow field and controllable mass transfer. In addition, the M-HETC allows exploration of the variations in the surface appearance of electrodeposits over a wide range of current densities in a single electroplating test… 

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