Effects of Bi & Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy

Abstract

The microstructures and melting behaviors of (Sn-9Zn)-2Cu (SZC) lead-free solder with 3%Bi and various amount of Ni additions were studied in the experiment. The wetting properties and the interfacial reaction of these alloys soldering on a Cu substrate were also examined. The results indicated that the addition of 3% Bi could decrease the melting point and… (More)

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@article{Xie2005EffectsOB, title={Effects of Bi & Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy}, author={H. P. Xie and D. Q. Yu and L. Wang}, journal={Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.}, year={2005}, pages={96-100} }