Effects of 3D via and die attach on power integrity of a packaged IC

@article{Lin2012EffectsO3,
  title={Effects of 3D via and die attach on power integrity of a packaged IC},
  author={Y. T. Lin and Yu-chih Lin and T. -S. Horng and Lih-Tyng Hwang},
  journal={2012 Asia Pacific Microwave Conference Proceedings},
  year={2012},
  pages={277-279}
}
In this paper, we first investigated the effects of 3D single and multi-via(s) on power integrity of a packaged IC. Backside vias have been an essential element in MMIC technology. This paper analyzed and characterized single and multiple backside via(s). The results of this investigation can be used as a design guideline for the now very popular Through… CONTINUE READING