Effect of the cooling rate in solidification on the electrical behavior of solder

@article{Yang2021EffectOT,
  title={Effect of the cooling rate in solidification on the electrical behavior of solder},
  author={Wenyi Yang and D. D. L. Chung},
  journal={Journal of Materials Science: Materials in Electronics},
  year={2021},
  volume={32},
  pages={7867 - 7874}
}
  • Wenyi Yang, D. Chung
  • Published 22 February 2021
  • Materials Science
  • Journal of Materials Science: Materials in Electronics
Solder is widely used for electrical interconnections in electronics, and its use involves the melting and subsequent solidification of the solder. This paper reports for the first time the effect of the cooling rate in solidification on the electrical behavior (conduction and dielectric behavior) of the solidified solder. Prior work addressed the effect of the cooling rate on the microstructure and mechanical properties only. The solder is Sn-4Ag (lead free, melting temperature 221 °C… 
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This work provides the first report of the effect of the dielectric behavior on the conduction behavior of solder. The lead-free solder studied contains 96 wt% tin and 4 wt% silver. The electric

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