Effect of mixing ratio of non-spherical particles in colloidal silica slurry on oxide CMP

@article{Lee2017EffectOM,
  title={Effect of mixing ratio of non-spherical particles in colloidal silica slurry on oxide CMP},
  author={Hojun Lee and Dasol Lee and Moonsung Kim and Haedo Jeong},
  journal={International Journal of Precision Engineering and Manufacturing},
  year={2017},
  volume={18},
  pages={1333-1338}
}
Colloidal silica and fumed silica are common slurry materials for oxide chemical mechanical polishing (CMP). Non-spherical colloidal silica particles are manufactured via a multi-step feeding method to compensate for the material removal rate of colloidal silica slurry, which is lower than that of fumed silica slurry. Additionally, mixed abrasive slurry has been used by combining non-spherical and spherical colloidal silica particles. Experiments were conducted on a 4-inch wafer with silicon… CONTINUE READING