Effect of impact force towards Cu wire bonding reliability

@article{Chia2015EffectOI,
  title={Effect of impact force towards Cu wire bonding reliability},
  author={Lee Cher Chia and Chua Kok Yau and Tan Sze Chee},
  journal={2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)},
  year={2015},
  pages={1-5}
}
Copper (Cu) wire bonding technology is now widely held in mass production of semiconductor industry. The main benefit is cost advantage against Au wire and secondly enhance product performance and reliability. More new products are design in with Cu wire bonding and new wire bonding machine also equipped with Cu wire bonding capability. The market trend… CONTINUE READING