Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding


0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.02.023 * Corresponding author. E-mail address: apequegn@uwaterloo.ca (A. Peque The development of novel Cu wires for thermosonic wire bonding is time consuming and the effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An online method is… (More)
DOI: 10.1016/j.microrel.2010.02.023


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