Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging

Sorry, there's nothing here.

Cite this paper

@article{Koo2007EffectOD, title={Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging}, author={Ja-Myeong Koo and Seung-Boo Jung}, journal={Microelectronics Reliability}, year={2007}, volume={47}, pages={2169-2178} }