Effect of deposition methods on dielectric breakdown strength of PECVD low-k carbon doped silicon dioxide dielectric thin films

@article{Zhou2004EffectOD,
  title={Effect of deposition methods on dielectric breakdown strength of PECVD low-k carbon doped silicon dioxide dielectric thin films},
  author={Heyu Zhou and F. G. Shi and Bin Zhao and J. Yota},
  journal={Microelectronics Journal},
  year={2004},
  volume={35},
  pages={571-576}
}