Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

@article{Kariya1998EffectOB,
  title={Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy},
  author={Yoshiharu Kariya and Masahisa Otsuka},
  journal={Journal of Electronic Materials},
  year={1998},
  volume={27},
  pages={866-870}
}
Sn-3.5mass%Ag eutectic solder is selected as a candidate base alloy for replacing the eutectic Sn-Pb, and the effect of bismuth (2, 5, 10mass%) on the fatigue life of bulk Sn-3.5mass%Ag eutectic at room temperature has been studied over the total strain range from 0.3 to 3 percent in tension-tension mode. Fatigue life is defined as the number of cycles at which the load decreases to a half of the initial value. The fatigue life dramatically decreases with increasing contents of bismuth and… CONTINUE READING

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