Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology

Abstract

Voids in ball grid array (BGA) solder joints have been considered as a main problem in lead-free soldering process. Compared with tin-lead solder, worse wetting capability of lead-free solder aggravates the formation of voids. Along with the wide application of BGA packages and the transition of lead-free soldering, the effect of voids on the reliability of… (More)

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