Effect of TSV interposer on the thermal performance of FCBGA package

  title={Effect of TSV interposer on the thermal performance of FCBGA package},
  author={Yen Yi Germaine Hoe and Tang Gong Yue and Pinjala Damaruganath and Chai Tai Chong and John H. Lau and Zhang Xiaowu and K. Vaidyanathan},
  journal={2009 11th Electronics Packaging Technology Conference},
In this paper, the effect of TSV (Through Silicon Via) parameters on the equivalent thermal conductivity of TSV interposer and the effect of the TSV interposer on the thermal performance of the package have been elaborated. The modeling approach using in this paper includes compact modeling for the package and detailed modeling for the TSV interposer. The objective of compact modeling is to study the effect of TSV interposer on thermal performance of the package, while the objective of detailed… CONTINUE READING
Highly Cited
This paper has 23 citations. REVIEW CITATIONS


Publications citing this paper.
Showing 1-10 of 19 extracted citations


Publications referenced by this paper.
Showing 1-6 of 6 references

Thermal Characterization of Baredie Stacked Modules with Cu through-vias.

  • Yasuhiro Yamaji, et, al
  • Proceedings of Electronic Components and…
  • 2001
1 Excerpt

Similar Papers

Loading similar papers…