Effect of TSV interposer on the thermal performance of FCBGA package

@article{Hoe2009EffectOT,
  title={Effect of TSV interposer on the thermal performance of FCBGA package},
  author={Yen Yi Germaine Hoe and Tang Gong Yue and Pinjala Damaruganath and Chai Tai Chong and John H. Lau and Zhang Xiaowu and K. Vaidyanathan},
  journal={2009 11th Electronics Packaging Technology Conference},
  year={2009},
  pages={778-786}
}
In this paper, the effect of TSV (Through Silicon Via) parameters on the equivalent thermal conductivity of TSV interposer and the effect of the TSV interposer on the thermal performance of the package have been elaborated. The modeling approach using in this paper includes compact modeling for the package and detailed modeling for the TSV interposer. The objective of compact modeling is to study the effect of TSV interposer on thermal performance of the package, while the objective of detailed… CONTINUE READING
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Thermal Characterization of Baredie Stacked Modules with Cu through-vias.

  • Yasuhiro Yamaji, et, al
  • Proceedings of Electronic Components and…
  • 2001
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