Effect of EFO settings on microstructure and hardness in the FAB of copper bonding wire

@article{Liu2012EffectOE,
  title={Effect of EFO settings on microstructure and hardness in the FAB of copper bonding wire},
  author={Dong Sheng Liu and Haibin Chen and Fei Liang Wong and Kan Yan Lee and Ivan K L Shiu and Jingshen Wu},
  journal={2012 IEEE 62nd Electronic Components and Technology Conference},
  year={2012},
  pages={1130-1135}
}
Continuously increasing price of gold becomes the major driving force for substituting the gold wire with copper wire in the field of wire bonding. However, since the hardness of copper is higher than that of gold, the potential risk for copper wire bonding is that Cu FAB would cause serious splash on aluminum pad and, even worse, damage of Si die. Since free air ball (FAB) formation is controlled by an electric flame-off (EFO) process, EFO settings would have an influence on the FAB… CONTINUE READING

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