Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array

Abstract

Since 3D-TSV technology has been more and more popular aiming at the demand of lightweight and multi-functions of electronic devices in recent years, the μ-C4 bumps with smaller size which interconnect the stacked die will suffer more serious operating stress, and even one of the thousands bumps fails, the device will fail. Hence, it is meaningful to… (More)

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