Effect of 3D stack-up integration on through silicon via characteristics

Abstract

Silicon interposers are a key component of 3D integration and the parasitic effects due to vias in interposers are known to contribute an important part to their overall electromagnetic properties. Therefore, the modeling has been extensively studied in recent years with numerous boundary conditions, port definitions, and further assumptions regarding the… (More)

7 Figures and Tables

Topics

  • Presentations referencing similar topics