EUV capping layer integrity

@inproceedings{Nesldek2018EUVCL,
  title={EUV capping layer integrity},
  author={P. Nesl{\'a}dek and J. Schmidt and Thorsten Krome},
  booktitle={Photomask Japan},
  year={2018}
}
The era of EUV technology is approaching and use of EUV lithography in chip manufacturing process was reported. The EUV technology has still serious challenges to overcome, to which belong defectivity, source power and throughput of the exposure tool, to name the most obvious. Important part of the lithography, which differs significantly from previous optical technology, is the mask. The mask stack, especially the multilayer (ML) mirror surface and its protection is of high importance… Expand

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