EFFECT OF Bi CONTENT ON PROPERTIES OF LOW SILVER SAC SOLDERS

Abstract

Since the adoption of RoHS and REACH regulations for electronics manufacturers, Sn-Ag-Cu (SAC) alloy systems have largely replaced the Sn-Pb solder alloys with Sn-3Ag0.5Cu (wt%) (SAC305) the most widely accepted. This high silver content SAC alloy (greater than X percent) has a major deficiency however, the relative fragility of the solder joint. This is… (More)

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