Dynamic behaviour of electronics package and impact reliability of BGA solder joints

@inproceedings{YU2003DynamicBO,
  title={Dynamic behaviour of electronics package and impact reliability of BGA solder joints},
  author={Q YU and H Kikuchil and S Ikedal and M Shiratoril and Mamoru Kakino and Noriyuki Fujiwara},
  year={2003}
}
The purposes of this study are to clarify the dynamic behavior of BGA(Ball Grid Array) or CSP(Chip Scale Package) packaging subjected to an impact loading, and to establish a simple analytical method of impact reliability assessment for solder joints. A 3-D analytical model of PCB mounted with a BGA chip was used to simulate the impact behavior of BGA packaging, and explicit-based FEM code LS-DYNA was used to carry out the dynamic analysis. It was found that the impact reliability of solder… CONTINUE READING