Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging

Abstract

This study investigates the dynamic flow characteristics of capillary-driven underfill flows in a flip chip package. In the present study, we used two different bump arrays using Sn-2.5Ag solder balls with 80 mm and 100 mm diameters on commercially available flip chips, which have different pitches of 150 mm and 180 mm. First, we measured surface tension… (More)

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