Ductility of thin copper films on rough polymer substrates

@inproceedings{Xu2011DuctilityOT,
  title={Ductility of thin copper films on rough polymer substrates},
  author={Weijin Xu and Jian-nan Yang and Tian Lu},
  year={2011}
}
  • Weijin Xu, Jian-nan Yang, Tian Lu
  • Published 2011
  • Materials Science
  • Electronic components in modern flexible electronics are connected by interconnects, which typically have the form of metal films resting on polymer substrates. This paper firstly studies experimentally the ductility of Cu films deposited on polyimide substrate with roughened surface (due to sandblasting) and finds that, upon tensile loading along the direction of film surface, the density of surface cracks in the film decreases with increasing surface roughness. The method of finite elements… CONTINUE READING

    Create an AI-powered research feed to stay up to date with new papers like this posted to ArXiv