Ductile-to-brittle transition strain rate

@article{Darveaux2006DuctiletobrittleTS,
  title={Ductile-to-brittle transition strain rate},
  author={Robert Darveaux and Corey Reichman},
  journal={2006 8th Electronics Packaging Technology Conference},
  year={2006},
  pages={283-289}
}
Solder joint failure mode depends on factors such as loading mode (shear vs. tensile), temperature, and strain rate. For any given loading mode and temperature, there is a transition from ductile failure to brittle failure as strain rate is increased. This ductile-to-brittle transition strain rate (DTBTSR) is one of the best indicators for robustness relative to impact loading. A higher value for DTBTSR is better. DTBTSR was measured for a wide range of lead free solder joints. The effects of… CONTINUE READING
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