Dual-chamber megasonic cleaning device

  title={Dual-chamber megasonic cleaning device},
  author={アレン, エル. ダンブラ, and ホイ チェン and アドリアン ブランク and ズイ ブリッチャー and リカード マルティネス},
The embodiments described herein relates to semiconductor device fabrication and, more particularly, to a dual megasonic module disposed vertically for cleaning a plurality of substrates simultaneously. In one embodiment, apparatus for cleaning a plurality of substrates is provided. The apparatus comprises an outer tank for collecting comprising at least one sidewall and a bottom, overflow process fluids. First internal module adapted to contain a processing fluid is partially positioned within… CONTINUE READING