Drop test simulation of 3D stacked-die packaging with Input-G finite element method

@article{Chen2010DropTS,
  title={Drop test simulation of 3D stacked-die packaging with Input-G finite element method},
  author={Zhaohui Chen and Xuefang Wang and Yong Liu and Sheng Liu},
  journal={2010 11th International Conference on Electronic Packaging Technology & High Density Packaging},
  year={2010},
  pages={742-746}
}
Transient responses of 3D stacked-die package with through silicon via (TSV) structure under board level drop test load following the JEDEC standard are investigated using the Input-G finite element simulation method. In order to reduce the finite element mesh size the stacked-die package under investigation is modeled with details while the others are simplified as blocks with equivalent material properties. The deflection and velocity responses of the stacked-die package located at center of… CONTINUE READING

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