Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

Abstract

The intermetallic growth in the Sn-Ag-Cu (SAC) solder joints fabricated on Cu or Cu-Zn solder wetting layer and its effect on the drop impact reliability have been studied. The drop test specimens were fabricated by connecting two printed circuit boards by reflowing SASC 405 solder balls on Cu or Cu-Zn wetting layers. And the drop test specimens were aged… (More)

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Cite this paper

@article{Kim2008DropIR, title={Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints}, author={Young Min Kim and Young Ho Kim}, journal={2008 International Conference on Electronic Materials and Packaging}, year={2008}, pages={236-238} }