Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

@article{Kim2008DropIR,
  title={Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints},
  author={Young Min Kim and Youngho Kim},
  journal={2008 International Conference on Electronic Materials and Packaging},
  year={2008},
  pages={236-238}
}
The intermetallic growth in the Sn-Ag-Cu (SAC) solder joints fabricated on Cu or Cu-Zn solder wetting layer and its effect on the drop impact reliability have been studied. The drop test specimens were fabricated by connecting two printed circuit boards by reflowing SASC 405 solder balls on Cu or Cu-Zn wetting layers. And the drop test specimens were aged at 150degC up to 500 hrs. The well known bi-layer of Cu6Sn5 and Cu3Sn with microvoids was formed at the SAC/Cu interfaces during aging. On… CONTINUE READING

From This Paper

Figures, tables, results, connections, and topics extracted from this paper.
2 Extracted Citations
9 Extracted References
Similar Papers

Citing Papers

Publications influenced by this paper.

Referenced Papers

Publications referenced by this paper.
Showing 1-9 of 9 references

Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu-Zn UBM

  • C. Y. Oh, H. R. Roh, Y.-H Kim
  • Proc. of International Microelectronics and…
  • 2007
1 Excerpt

Electronic structure mechanism for the wettability of Sn - based solder alloys , 1

  • C. Wang Feng, M. Morinaga
  • IBM Res . Rep .
  • 2005

Electronic structure mechanism for the wettability of Sn-based solder alloys, 1. Electron

  • W. Feng, C. Wang, M. Morinaga
  • Mater. 31,
  • 2002
1 Excerpt

Six cases of reliability study of Pb - free solder joints in electronic packaging technology

  • Y.-H Kim
  • Mater . Sci . Eng . Rep .
  • 2002

Six cases of reliability study of Pb-free solder joints in electronic packaging technology, Mater

  • K. Zeng, K. N. Tu
  • 2002
1 Excerpt

Wetting reaction versus solid state aging of eutectic SnPb on Cu , 1

  • D. Leonard Sung K. Kang, L. Gignac, D. W. Henderson, S. Cho
  • App 1 . Phys .
  • 2001

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-tree, tin-rich solders, 1

  • S. K. Kang, R. S. Rai, S. Purushothaman
  • Electron. Mater.,
  • 1996
1 Excerpt

A viable Tin-Lead solder substitute

  • Chad M. Miller, Iver E. Anderson, Jack F. Smith
  • J. Electron. Mater., 23,
  • 1994
1 Excerpt

Improved Inechanical properties in new, Pb-tree solder alloys, 1

  • M. McCorMack, S. Jin
  • Electron. Mater.,
  • 1994
1 Excerpt

Similar Papers

Loading similar papers…