Drie of fused silica

@article{Cao2013DrieOF,
  title={Drie of fused silica},
  author={Zongliang Cao and B. VanDerElzen and Kenneth Owen and Jialiang Yan and Guohong He and R. L. Peterson and D. Grimard and Khalil Najafi},
  journal={2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)},
  year={2013},
  pages={361-364}
}
This paper reports detailed characterization results of deep reactive ion etching of fused silica with three different masking materials: single-crystal Si, negative photoresist KMPR and SU-8. With an optimized etch recipe, KMPR and SU-8 show higher effective mask selectivity, are easier to integrate and remove than Si, making them better masks for creating high-aspect ratio features. Using a KMPR mask, a high aspect ratio (8:1) etch with a 6-μm mask opening is obtained. SU-8 masks also achieve… CONTINUE READING

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