Double bump flip-chip assembly

@article{Yan2006DoubleBF,
  title={Double bump flip-chip assembly},
  author={K. W. Yan and R. Wayne Johnson and Russell Stapleton and Kushal Ghosh},
  journal={IEEE Transactions on Electronics Packaging Manufacturing},
  year={2006},
  volume={29},
  pages={119-133}
}
Capillary underfill remains the dominate process for underfilling Hip-chip die both in packages and for direct chip attach (DCA) on printed circuit board (PCB) assemblies. Capillary underfill requires a post reflow dispense and cure operation, and the underflow time increases with increasing die area and decreasing die-to-substrate spacing. Fluxing or no-How underfills are dispensed prior to die placement and cure during the solder reflow cycle. Since filler particles in the fluxing underfill… CONTINUE READING