Dissolution behaviors of the Ni and Ni3Sn4 phase in molten lead-free solders

Abstract

This study investigates the dissolution behavior of metallic substrates-Ni and IMC-Ni<sub>3</sub>Sn<sub>4</sub> phase in molten Sn, SAC, SC, SB and SZ at 240, 270, and 300°C. The dissolution rates of the Ni substrate in molten solder follow the order Sn >; SAC >; SC >; SB >; SZ. Many the Ni<sub>3</sub>Sn<sub>4</sub> phases with a small grain size were… (More)

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