Direct metal to metal bonding for microsystems interconnections and integration

@article{Ang2005DirectMT,
  title={Direct metal to metal bonding for microsystems interconnections and integration},
  author={X. F. Ang and G. G. Zhang and B. K. Tan and Jun Wei and Zhongbi Chen and C. Wong},
  journal={2005 7th Electronic Packaging Technology Conference},
  year={2005},
  volume={2},
  pages={4 pp.-}
}
In microsystems integration, microsystem devices with different functions are needed to be electrically connected. To meet higher component needs, more functions are configured within each device which leads to a significant potential in microsystems integration, industrial interests have grown exponentially in search of complementing integration and low temperature direct interconnection bonding technology to bridge this bottleneck. This area is especially profound in flip-chip… CONTINUE READING
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