Direct connection and testing of TSV and microbump devices using NanoPierce™ contactor for 3D-IC integration

  title={Direct connection and testing of TSV and microbump devices using NanoPierce™ contactor for 3D-IC integration},
  author={Onnik Yaglioglu and Ben Eldridge},
  journal={2012 IEEE 30th VLSI Test Symposium (VTS)},
Testing of Through Silicon Via (TSV) and Micro-Bump (MB) devices by physical connection through the TSVs presents unique challenges due to the very high density of the connections, and the potential impact of contact testing on subsequent assembly steps. In addition, the very high signal counts that are the main benefit of TSV connection schemes make conventional wafer probing, particularly for memory devices which demand very high parallelism at production wafer sort, largely impractical. We… CONTINUE READING
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