Direct bonding and debonding of glass wafers for handling of ultra-thin glass sheets

@article{Takeuchi2016DirectBA,
  title={Direct bonding and debonding of glass wafers for handling of ultra-thin glass sheets},
  author={Kai Takeuchi and Masahisa Fujino and Tadatomo Suga},
  journal={2016 International Conference on Electronics Packaging (ICEP)},
  year={2016},
  pages={298-301}
}
In this sturdy, we investigated the bonding and debonding of the glass wafers using Surface Activated Bonding (SAB) method with the Si and Fe intermediate layers. In the fabrication process of the Thin Film Transistors (TFTs) on the ultra thin glass substrates for the display devices, the glass substrates are handled at high temperature and can be easily… CONTINUE READING