Digital-pixel Focal Plane Array Development

Abstract

Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 μm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 μm have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology.

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Cite this paper

@inproceedings{Razeghi2009DigitalpixelFP, title={Digital-pixel Focal Plane Array Development}, author={Manijeh Razeghi and Rengarajan Sudharsanan and Matthew Brown and Justin J. Baker and Curtis Colonero and Joe Costa and Tom Gardner and Mike Kelly and Ken Schultz and Brian M. Tyrrell and J. E. Wey}, year={2009} }