Dielectric resolution enhancement coating technology (DiRECT) - a sub-90 nm space and hole patterning technology using 248-nm lithography and plasma-enhanced polymerization

@article{Liang2003DielectricRE,
  title={Dielectric resolution enhancement coating technology (DiRECT) - a sub-90 nm space and hole patterning technology using 248-nm lithography and plasma-enhanced polymerization},
  author={Ming-Chung Liang and Hsin-Yi Tsai and Chia-Chi Chung and Cheng-Chen Hsueh and Hokyoon Chung and Chih-Yuan Lu},
  journal={IEEE Electron Device Letters},
  year={2003},
  volume={24},
  pages={562-564}
}
A plasma polymerization coating process named Dielectric Resolution Enhancement Coating Technology (DiRECT) is proposed to shrink critical dimensions (CDs) of space and hole patterns. Fluorocarbon plasmas are used as the precursors to coat a polymer layer on the patterned photo-resist. By adding only one processing step, we are able to shrink poly space and… CONTINUE READING