Die fracture probability prediction and design guidelines for laminate-based over-molded packages

@article{Yang2008DieFP,
  title={Die fracture probability prediction and design guidelines for laminate-based over-molded packages},
  author={Daoguo Yang and J. A. Bielen and F. Theunis and W. D. van Driel and G. Q. Zhang},
  journal={EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems},
  year={2008},
  pages={1-6}
}
Transferring molding process is widely used in the plastic IC packaging. Die cracking failures due to transfer molding process may occur. In this paper, an investigation on the die fracture and its failure probability is conducted. The approaches and results of die strength characterization, FE modeling on the laminate-based packages, and simulation-based prediction of the die fracture probability rate are presented. Weibull statistics model was used to describe the probability distribution… CONTINUE READING

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