Die bonding of silicon and other materials with active solder

@article{Peng2010DieBO,
  title={Die bonding of silicon and other materials with active solder},
  author={Cong Peng and Mingxiang Chen and Sheng Liu},
  journal={2010 11th International Conference on Electronic Packaging Technology \& High Density Packaging},
  year={2010},
  pages={275-278}
}
  • Cong Peng, Mingxiang Chen, Sheng Liu
  • Published 23 September 2010
  • Materials Science
  • 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
The surfaces of optoelectronic materials such as silicon, GaAs, nitrides and oxides are known to be very difficult to bond with low melting point solders(<300°C). Small portion of active elements (3.1~4.1wt% Ti and 0.2% Ce) added into conventional SnAg solder could improve its solderability with inorganic material surfaces. In this work, some bonding experiments using active solder containing active elements were carried out. Bonding and mechanical behaviors of active solder were compared with… 

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References

SHOWING 1-7 OF 7 REFERENCES

Rare-earth additions to lead-free electronic solders

The research in lead(Pb)-free solder alloy has been a popular topic in recent years, and has led to commercially available Pb-free alloys. Further research in certain properties to improve aspects

Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy

The purpose of this study is to investigate the effects of small amounts of Ni, P and Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. The results indicate that

Bonding nature of rare-earth-containing lead-free solders

The ability of rare-earth-containing lead-free solders to wet and bond to silica was investigated. Small additions of Lu (0.5–2 wt. %) added to eutectic Sn–Ag or Au–Sn solder render it directly

Lead-free universal solders for optical and electronic devices

Widely used electronic components and optical materials are made up of a variety of inorganic materials, such as nitrides, carbides, oxides, sulfides, fluorides, selenides, diamond, silicon, and