Development of thick film, CMOS compatible planar millimetre-wave antenna for antennas in package applications

@article{Granados2017DevelopmentOT,
  title={Development of thick film, CMOS compatible planar millimetre-wave antenna for antennas in package applications},
  author={L. K. Sandoval Granados and R. S. Murphy Arteaga},
  journal={Microsystem Technologies},
  year={2017},
  volume={23},
  pages={2927-2930}
}
In this work, PI2611 polyimide is proposed as the dielectric layer to be able to integrate 60 GHz antennas into RF-chips. For this work, six layers were deposited on a silicon wafer using a multiple spin-coating process that included two final hard-bakes. The spin-coating process, however, can be repeated to obtain the desired thickness, thus eliminating the technological restriction existing in materials with different a coefficient of thermal expansion than that of silicon, where only two or… CONTINUE READING

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