Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

@article{Knickerbocker2005DevelopmentON,
  title={Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection},
  author={John U. Knickerbocker and Paul S. Andry and L. Paivikki Buchwalter and Alina Deutsch and Raymond R. Horton and Keith A. Jenkins and Young Hoon Kwark and Gerald McVicker and Chirag S. Patel and Robert J. Polastre and Christian D. Schuster and Arun Sharma and Sri M. Sri-Jayantha and Christopher W. Surovic and Cornelia K. Tsang and Bucknell C. Webb and Steven L. Wright and Samuel R. McKnight and Edmund J. Sprogis and Bing Dang},
  journal={IBM Journal of Research and Development},
  year={2005},
  volume={49},
  pages={725-754}
}
of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection J. U. Knickerbocker P. S. Andry L. P. Buchwalter A. Deutsch R. R. Horton K. A. Jenkins Y. H. Kwark G. McVicker C. S. Patel R. J. Polastre C. Schuster A. Sharma S. M. Sri-Jayantha C. W. Surovic C. K. Tsang B. C. Webb S. L. Wright S. R. McKnight E. J. Sprogis B. Dang System-on-Package (SOP) technology based on silicon carriers has the potential to provide modular design flexibility… CONTINUE READING

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