Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization


3D IC integration can be accomplished by using the approaches such as chip-on-chip, chip-on-wafer and wafer-on-wafer integration. The scheme of chip-on-chip shows the advantages of high flexibility and yield during assembly process. However, low fabrication throughput has been a major issue. When compared to chip-on-chip integrations, wafer-on-wafer may… (More)


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