Development of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology with wideband ultralow PDN impedance

Abstract

We have developed a new chip capacitor embedded interposer using a narrow gap chip parts mounting technology. This interposer is expected to reduce power distribution network (PDN) impedance. To investigate the efficacy of the interposer, we have fabricated other various types of capacitor embedded interposer test element group (TEG), such as a generally… (More)

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